Expanding the functionality of Internet of Things (IoT) networks, Texas Instruments (TI) (NASDAQ: TXN) today announced availability for mass production of the industry’s lowest-power dual-band wireless microcontroller (MCU) supporting Sub-1 GHz and Bluetooth® low energy connectivity on a single chip. As part of TI’s pin-to-pin and software compatible SimpleLink™ ultra-low power platform, the new SimpleLink dual-band CC1350 wireless MCU enables developers to move from a three-chip solution to a tiny single chip, while reducing design complexity, saving power, cost and board space. The CC1350 wireless MCU offers a range of up to 20 km on a coin cell battery for building and factory automation, alarm and security, smart grid, asset tracking and wireless sensor network applications. For more information, visit www.ti.com/cc1350-pr.
To view the multimedia release go to:
http://www.multivu.com/players/English/7746254-texas-instruments-simplelink-dual-band-cc1350/
NI (Nasdaq: NATI) today announced VirtualBench, an all-in-one instrument that integrates a mixed-signal oscilloscope, function generator, digital multimeter, programmable DC power supply and digital I/O. Users interact with VirtualBench through software applications that run on PCs or iPads. The device provides the most common functionality affordably and opens up new possibilities for how engineers can use benchtop instruments.
To view the Multimedia News Release, go to http://www.multivu.com/mnr/7230751-ni-reshapes-instrumentation-with-software-based-device-virtualbench
Texas Instruments (TI) (NASDAQ: TXN) today announced the new SimpleLink™ ultra-low power wireless microcontroller (MCU) platform that helps customers go battery-less with energy harvesting or enjoy always-on, coin cell-powered operation for multiple years. With this industry-first technology, customers have the flexibility to develop products that support multiple wireless connectivity standards using a single-chip and identical RF design. The SimpleLink ultra-low power platform supports Bluetooth® low energy, ZigBee®, 6LoWPAN, Sub-1 GHz, ZigBee RF4CE™ and proprietary modes up to 5Mbps. This platform expands TI’s SimpleLink portfolio, the broadest, lowest power and easiest to use wireless connectivity offering in the industry for the Internet of Things (IoT). For more information, visit www.ti.com/simplelinkulp.
To view the Multimedia News Release, go to http://www.multivu.com/players/English/70647527-texas-instruments-simplelink/
Imagine a device worn on your finger that allows intuitive, touch-free interaction with the digital world. Imagine a solar panel the size of a microcontroller that enables environmental intelligence in any building. Imagine integrating carbon monoxide sensing, thermostat control and biometric security capabilities to a smoke detector without increasing its size. This smarter, greener, battery-free world is fast becoming a reality with the world’s lowest-power microcontroller platform from Texas Instruments Incorporated (TI) (NASDAQ: TXN). Codenamed “Wolverine” for its aggressive power-saving technology, this ultra-low-power MSP430 microcontroller platform offers at least 50 percent less power consumption than any other microcontroller in the industry (360 nA real-time clock mode and less than 100 µA/MHz active power consumption). The first devices based on this platform will be the MSP430FR58xx microcontroller series with expected availability in June 2012.
To view Multimedia News Release, go to http://www.multivu.com/mnr/54041-texas-instruments-ti-wolverine-microcontroller-platform
Achieving another wireless connectivity milestone, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the WiLink™ 8.0 product family: a collection of 45-nanometer single-chip solutions that integrate up to five different radios, and set the stage for next-generation mobile Wi-Fi®, GNSS, NFC, Bluetooth® and FM transmit/receive applications. The WiLink 8.0 architecture supports various combinations of these technologies, allowing for customized solutions to address the unique needs and price points of all mobile markets. Each chip variant comes in a compact WSP package that can be mounted directly on a PCB, and includes all required RF front ends, a complete power management system, and comprehensive coexistence mechanisms. At the system level, the five-radio WiLink 8.0 chip offers a 60 percent cost reduction, 45 percent decrease in size and 30 percent lower power consumption compared to traditional multi-chip offerings. Complete details: www.ti.com/wilink8.
To view Multimedia News Release, go to http://www.multivu.com/mnr/54040-texas-instruments-ti-wilink8-5-in-1-wireless-connectivity-next-gen-mobile
Building from more than a decade of proven leadership in the wireless connectivity space, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today unveiled the SimpleLink™ product family, the industry’s widest portfolio of easy-to-use wireless connectivity technologies for low-power, low-cost embedded applications. The SimpleLink family includes self-contained wireless processors, aimed at enabling easy integration with any embedded system.
The cornerstone offering in this new family is the new SimpleLink Wi-Fi® CC3000 product: an easy-to-implement Wi-Fi solution that will lead the charge in expanding the world’s Internet of Things. The SimpleLink Wi-Fi CC3000 is a self-contained 802.11 network processor, making it ideal for simple and quick addition of Internet connectivity to any embedded application. For full details on the SimpleLink Wi-Fi CC3000 and all SimpleLink products, visit http://ti.com/simplelink.
To view Multimedia News Release, go to http://www.multivu.com/mnr/54039-texas-instruments-launches-product-family-simplelink-wi-fi-cc3000
Texas Instruments (TI), the most trusted brand in graphing calculator technology, “took a major step forward in our mission to improve student understanding and achievement in mathematics” with the release today of two new innovative apps: TI-Nspire™ App for iPad and TI-Nspire™ CAS App for iPad, said Melendy Lovett, president of Texas Instruments Education Technology.
To view Multimedia News Release, go to http://www.multivu.com/mnr/54045-texas-instruments-unveils-breakthrough-ti-nspire-apps-for-ipad
Texas Instruments (TI) today announced the TI-Innovator™ Rover, the company’s first robotics solution for middle and high school students that makes learning STEM subjects a moving experience. Students can write programs on their TI graphing calculators that get Rover’s wheels turning and their minds learning in a fun, interactive and hands-on way.
Rover connects to the TI-Innovator Hub and either a TI-84 Plus CE or TI-Nspire™ CX graphing calculator that many students already have and drives interest and curiosity in science, technology, engineering and math (STEM) subjects. Students without any exposure to coding or robotics can get started by writing a basic program to make Rover do things like draw, dance or even crash.
To view the multimedia release go to:
https://www.multivu.com/players/English/7746259-ti-introduces-ti-innovator-rover-robot/
There’s a lot more to Hollywood magic than smoke and mirrors – popular movie and TV shows about zombies, superheroes, spaceships and true crime only come to life because of science, technology, engineering and math (STEM).
That’s why Texas Instruments (TI) is launching “STEM Behind Hollywood,” an exciting new education program developed with assistance from The Science & Entertainment Exchange, a program of the National Academy of Sciences, as well as actress, neuroscientist and STEM education advocate Mayim Bialik.
To view Multimedia News Release, go to http://www.multivu.com/mnr/54048-texas-instruments-stem-behind-hollywood-program-with-mayim-bialik
Texas Instruments Incorporated (NYSE: TXN) (TI) today unveiled the TMS320TCI6612 and TMS320TCI6614, the industry’s most comprehensive System-on-Chips (SoCs) for developers of metro, pico and enterprise small cell base stations. TI’s new small cell SoCs are enabled with production ready software and are the highest performing devices available for small cells. Based on TI’s innovative KeyStone multicore architecture, these scalable SoCs encompass a mix of processing elements including radio accelerators, network and security coprocessors, combined fixed-and floating-point digital signal processors (DSPs) and an ARM® RISC processor, providing the ideal foundation for layers 1, 2 and 3 and transport processing for high performance small cell base stations.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/texasinstruments/39165/
Texas Instruments (TI) (NYSE: TXN) expands its portfolio of industry-leading Sitara™ ARM® microprocessors (MPUs) with new AM389x Sitara ARM MPUs that dramatically boost performance and integration. Offering the industry’s highest-performing, single-core ARM Cortex™-A8 with performance at up to 1.5 GHz, the AM389x Sitara ARM MPUs also integrate peripherals that make them perfect for applications such as single-board computers, gateways, routers, servers, industrial automation, human machine interfaces (HMIs) and point-of-service data terminals. These newest high-performance AM389x Sitara ARM MPUs enable faster end products that include network connectivity, graphical user interfaces and display capabilities and the ability to run multiple applications simultaneously for multiple operating systems, such as Linux, Microsoft® Windows® Embedded Compact 7 and Android.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/texasinstruments/39157/
