Mobile software developers now have an accessible, well-equipped open source development tool based on the high performance OMAP™ 4 platform in the form of PandaBoard. This new, low-cost board provides unprecedented access to the OMAP 4 applications processor platform from Texas Instruments Incorporated (TI), which is power- and performance-optimized for Smartphones and other mobile devices. A growing online community of Linux experts supports PandaBoard developers designing on various mobile open source software distributions such as Android, Angstrom, Chrome, MeeGo and Ubuntu.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/pandaboard/39158/
Texas Instruments Incorporated (TI) (NYSE: TXN) today introduced the CC2567 device, the first wireless, single-chip solution that enables direct short-range communication between ultra low-power, ANT™+-enabled devices and commonly used mobile devices relying on Bluetooth® technology such as PCs, Smartphones and tablets. The industry’s first dual-mode device, the CC2567 requires 80 percent less board area than a design with two single-mode solutions (one ANT+, one Bluetooth), enables simultaneous operation over a shared antenna with built-in coexistence, and increases the wireless transmission range up to two times the distance of a single-mode ANT+ solution.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/texasinstruments/39160/
Texas Instruments Incorporated (TI) (NYSE: TXN) announced today the next generation of its popular OMAP™ family: the OMAP 5 mobile applications platform, which is positioned to transform how mobile devices, such as Smartphones, tablets and other mobile form factors are used, making them even more valuable in our daily lives. More information on the OMAP 5 platform can be found here: www.ti.com/wbu_omap5_pr_lp.
To view Multimedia News release, go to http://multivu.prnewswire.com/mnr/texasinstruments/39161/
Designed to help developers obtain safety certifications, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced its new Hercules safety microcontroller platform for medical, industrial and transportation applications. The platform consists of three ARM Cortex-based microcontroller families that deliver scalable performance, connectivity, memory and safety features for applications that require a high level of reliability. Unlike many microcontrollers that rely heavily on software for safety capabilities, Hercules microcontrollers implement safeguards in hardware to maximize performance and reduce software overhead. Coupled with robust tools, software and safety documentation, this functionality gives developers the headroom to differentiate their end products and speed time to market. For more information, visit www.ti.com/hercules-pr-lp.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/texasinstruments/39162/
Imagine upgrading from ARM9™-based product designs to add 3D interactive touch screens, higher resolution displays, faster performance and multiple, flexible integrated connectivity options for a more robust offering — all while keeping design costs and power levels low. Visualize taking these new products to market in six months with an inexpensive development platform and free, complete software development kit. Texas Instruments Incorporated (NYSE: TXN) (TI) now makes this design vision a reality with its new Sitara™ AM335x ARM® Cortex™-A8 microprocessors .
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/texasinstruments/51795/
To most technologists, cloud computing is about applications, servers, storage and connectivity. To Texas Instruments Incorporated (TI) (NASDAQ: TXN) it means much more. Today, TI is unveiling a BETTER way to cloud with six new multicore System-on-Chips (SoCs). Based on its award winning KeyStone architecture, TI’s SoCs are designed to revitalize cloud computing, inject new verve and excitement into pivotal infrastructure systems and, despite their feature rich specifications and superior performance, actually reduce energy consumption.
To view Multimedia News Release, go to http://www.multivu.com/mnr/54044-texas-instruments-keystone-multicore-socs-revitalize-cloud-applications
Texas Instruments (TI) (NASDAQ: TXN) today unveiled the industry’s first inductance-to-digital converter (LDC), a new data converter category that uses coils and springs as inductive sensors to deliver higher resolution, increased reliability, and greater flexibility than existing sensing solutions at a lower system cost. Inductive sensing is a contactless sensing technology that can be used to measure the position, motion, or composition of a metal or conductive target, as well as detect the compression, extension or twist of a spring. For more information about this new data converter technology and the industry’s first LDC, the LDC1000, visit www.ti.com/ldc1000-pr.
To view Multimedia News Release, go to http://www.multivu.com/mnr/54049-texas-instruments-inductive-to-digital-converter-motion-sensing
Texas Instruments (TI) (NASDAQ: TXN) announces the newest additions to the Tiva™ C Series microcontroller (MCU) platform. The Tiva TM4C129x MCUs are the industry’s first ARM® Cortex™-M4-based MCUs with Ethernet MAC+PHY, enabling customers to create a new class of sophisticated, highly connected products that bridge the cloud and amplify the ever-growing Internet of Things (IoT). The feature-rich Tiva TM4C129x MCUs offer an unprecedented number of simultaneous connectivity options, as well as on-chip data protection and LCD controller to save significant board space and enable connected, advanced applications, such as home/building automation gateways, connected human-machine interface (HMI), networked sensor gateways, security access systems, programmable logic controllers and many others.
To view Multimedia News Release, go to http://www.multivu.com/mnr/54050-texas-instruments-tiva-c-series-arm-cortex-m4-ethernet-internet-of-things
Texas Instruments (TI) (NASDAQ: TXN) today announced the new SimpleLink™ ultra-low power wireless microcontroller (MCU) platform that helps customers go battery-less with energy harvesting or enjoy always-on, coin cell-powered operation for multiple years. With this industry-first technology, customers have the flexibility to develop products that support multiple wireless connectivity standards using a single-chip and identical RF design. The SimpleLink ultra-low power platform supports Bluetooth® low energy, ZigBee®, 6LoWPAN, Sub-1 GHz, ZigBee RF4CE™ and proprietary modes up to 5Mbps. This platform expands TI’s SimpleLink portfolio, the broadest, lowest power and easiest to use wireless connectivity offering in the industry for the Internet of Things (IoT). For more information, visit www.ti.com/simplelinkulp.
To view the Multimedia News Release, go to http://www.multivu.com/players/English/70647527-texas-instruments-simplelink/
Texas Instruments (TI) today launched STEM Behind Cool Careers, a series of calculator activities and videos designed to introduce middle and high school students to unexpected science, technology, engineering and math (STEM) careers. The fun, free activities are designed for the TI-Nspire™ CX and TI-84 Plus CE graphing calculators to show students how a solid understanding of STEM subjects is vital for any career, even careers students least expect.
To view the multimedia release go to:
https://www.multivu.com/players/English/7746258-ti-john-urschel-stem-careers/
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