Here's an excellent truncated review and demo of the Journey Instruments Overhead OF660 carbon fiber collapsible travel guitar. Special thanks to David Youngman for his superb review and demonstration of perhaps the best all-round travel guitar on the planet!
For Details on the Journey Instruments Overhead OF660: http://www.journeyinstruments.com/product/carbon-fiber-of660/
To Find a Journey Instruments Dealer: http://www.journeyinstruments.com/become-a-journey-instruments-dealer/find-journey-instruments-dealer/
For More Information about David Youngman: http://davidyoungmanmusic.com/
This video gives a demo and overview of the feature set for the Overhead travel guitar by Journey Instruments. For detailed specs, visit: http://journeyinstruments.com/product-category/guitars/ Like us on Facebook for updates and news! https://www.facebook.com/JourneyInstruments
National Instruments (Nasdaq: NATI) today announced LabVIEW 2010, the latest version of the graphical programming environment for design, test, measurement and control applications. LabVIEW 2010 delivers time savings with new features such as off-the-shelf compiler technologies that execute code an average of 20 percent faster and a comprehensive marketplace for evaluating and purchasing add-on toolkits for easily integrating custom functionality into the platform. For field-programmable gate array (FPGA) users, LabVIEW 2010 delivers a new IP Integration Node that makes it possible to integrate any third-party FPGA IP into LabVIEW applications and is compatible with the Xilinx CORE Generator. National Instruments also implemented more than a dozen new features suggested by lead users through the LabVIEW Idea Exchange, an online feedback forum that marks a significant new level of collaboration between NI R&D and customers.
To view Multimedia News Release. go to http://multivu.prnewswire.com/mnr/nationalinstruments/45173/
Texas Instruments (TI) (NYSE: TXN) expands its portfolio of industry-leading Sitara™ ARM® microprocessors (MPUs) with new AM389x Sitara ARM MPUs that dramatically boost performance and integration. Offering the industry’s highest-performing, single-core ARM Cortex™-A8 with performance at up to 1.5 GHz, the AM389x Sitara ARM MPUs also integrate peripherals that make them perfect for applications such as single-board computers, gateways, routers, servers, industrial automation, human machine interfaces (HMIs) and point-of-service data terminals. These newest high-performance AM389x Sitara ARM MPUs enable faster end products that include network connectivity, graphical user interfaces and display capabilities and the ability to run multiple applications simultaneously for multiple operating systems, such as Linux, Microsoft® Windows® Embedded Compact 7 and Android.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/texasinstruments/39157/
Mobile software developers now have an accessible, well-equipped open source development tool based on the high performance OMAP™ 4 platform in the form of PandaBoard. This new, low-cost board provides unprecedented access to the OMAP 4 applications processor platform from Texas Instruments Incorporated (TI), which is power- and performance-optimized for Smartphones and other mobile devices. A growing online community of Linux experts supports PandaBoard developers designing on various mobile open source software distributions such as Android, Angstrom, Chrome, MeeGo and Ubuntu.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/pandaboard/39158/
Texas Instruments Incorporated (TI) (NYSE: TXN) today announced delivery of a mobile-grade, battery-optimized Wi-Fi solution to the open source Linux community as part of the OpenLink™ project, focused on providing a wide range of wireless connectivity solutions for native Linux. Customers and developers targeting battery-powered Wi-Fi products can now use TI’s OpenLink drivers, gaining native kernel benefits such as tested technologies, faster time-to-market, and simplified re-integration when upgrading from one kernel version to the next. In addition to Wi-Fi, the OpenLink project includes native Linux solutions for Bluetooth® and FM technologies, and will expand to support other technologies such as ANT, Bluetooth Low Energy and ZigBee®. TI will also introduce additional low-power features to the kernel when possible. Visit www.openlink.org for source code, development projects, community support and more.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/texasinstruments/39163/
Texas Instruments Incorporated (NYSE: TXN) (TI) today unveiled the TMS320TCI6612 and TMS320TCI6614, the industry’s most comprehensive System-on-Chips (SoCs) for developers of metro, pico and enterprise small cell base stations. TI’s new small cell SoCs are enabled with production ready software and are the highest performing devices available for small cells. Based on TI’s innovative KeyStone multicore architecture, these scalable SoCs encompass a mix of processing elements including radio accelerators, network and security coprocessors, combined fixed-and floating-point digital signal processors (DSPs) and an ARM® RISC processor, providing the ideal foundation for layers 1, 2 and 3 and transport processing for high performance small cell base stations.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/texasinstruments/39165/
Designed to help developers obtain safety certifications, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced its new Hercules safety microcontroller platform for medical, industrial and transportation applications. The platform consists of three ARM Cortex-based microcontroller families that deliver scalable performance, connectivity, memory and safety features for applications that require a high level of reliability. Unlike many microcontrollers that rely heavily on software for safety capabilities, Hercules microcontrollers implement safeguards in hardware to maximize performance and reduce software overhead. Coupled with robust tools, software and safety documentation, this functionality gives developers the headroom to differentiate their end products and speed time to market. For more information, visit www.ti.com/hercules-pr-lp.
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/texasinstruments/39162/
Imagine upgrading from ARM9™-based product designs to add 3D interactive touch screens, higher resolution displays, faster performance and multiple, flexible integrated connectivity options for a more robust offering — all while keeping design costs and power levels low. Visualize taking these new products to market in six months with an inexpensive development platform and free, complete software development kit. Texas Instruments Incorporated (NYSE: TXN) (TI) now makes this design vision a reality with its new Sitara™ AM335x ARM® Cortex™-A8 microprocessors .
To view Multimedia News Release, go to http://multivu.prnewswire.com/mnr/texasinstruments/51795/
Building from more than a decade of proven leadership in the wireless connectivity space, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today unveiled the SimpleLink™ product family, the industry’s widest portfolio of easy-to-use wireless connectivity technologies for low-power, low-cost embedded applications. The SimpleLink family includes self-contained wireless processors, aimed at enabling easy integration with any embedded system.
The cornerstone offering in this new family is the new SimpleLink Wi-Fi® CC3000 product: an easy-to-implement Wi-Fi solution that will lead the charge in expanding the world’s Internet of Things. The SimpleLink Wi-Fi CC3000 is a self-contained 802.11 network processor, making it ideal for simple and quick addition of Internet connectivity to any embedded application. For full details on the SimpleLink Wi-Fi CC3000 and all SimpleLink products, visit http://ti.com/simplelink.
To view Multimedia News Release, go to http://www.multivu.com/mnr/54039-texas-instruments-launches-product-family-simplelink-wi-fi-cc3000
Achieving another wireless connectivity milestone, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the WiLink™ 8.0 product family: a collection of 45-nanometer single-chip solutions that integrate up to five different radios, and set the stage for next-generation mobile Wi-Fi®, GNSS, NFC, Bluetooth® and FM transmit/receive applications. The WiLink 8.0 architecture supports various combinations of these technologies, allowing for customized solutions to address the unique needs and price points of all mobile markets. Each chip variant comes in a compact WSP package that can be mounted directly on a PCB, and includes all required RF front ends, a complete power management system, and comprehensive coexistence mechanisms. At the system level, the five-radio WiLink 8.0 chip offers a 60 percent cost reduction, 45 percent decrease in size and 30 percent lower power consumption compared to traditional multi-chip offerings. Complete details: www.ti.com/wilink8.
To view Multimedia News Release, go to http://www.multivu.com/mnr/54040-texas-instruments-ti-wilink8-5-in-1-wireless-connectivity-next-gen-mobile
Envision a wireless experience with maximum data rates and no dropped calls at cell edges. Envision limited service areas being a thing of the past. Envision lower costs and greener solutions for base stations. Now, envision the technology that makes all of this is possible. Texas Instruments Incorporated (TI) (NASDAQ: TXN) today is unveiling the industry’s most comprehensive wireless infrastructure System-on-Chip (SoC), featuring an ideal mix of processing elements for both ultra-high capacity small cell and macro base stations. TI’s scalable TMS320TCI6636 delivers breakthrough performance, simultaneous 3G and 4G coverage and capacity expansion features that wireless operators and their users will love. For more information please visit www.ti.com/multicore.
To view Multimedia News Release, go to http://www.multivu.com/mnr/54042-texas-instruments-ti-multi-standard-soc-ultra-high-capacity
