Imagine a device worn on your finger that allows intuitive, touch-free interaction with the digital world. Imagine a solar panel the size of a microcontroller that enables environmental intelligence in any building. Imagine integrating carbon monoxide sensing, thermostat control and biometric security capabilities to a smoke detector without increasing its size. This smarter, greener, battery-free world is fast becoming a reality with the world’s lowest-power microcontroller platform from Texas Instruments Incorporated (TI) (NASDAQ: TXN). Codenamed “Wolverine” for its aggressive power-saving technology, this ultra-low-power MSP430 microcontroller platform offers at least 50 percent less power consumption than any other microcontroller in the industry (360 nA real-time clock mode and less than 100 µA/MHz active power consumption). The first devices based on this platform will be the MSP430FR58xx microcontroller series with expected availability in June 2012.
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Envision a wireless experience with maximum data rates and no dropped calls at cell edges. Envision limited service areas being a thing of the past. Envision lower costs and greener solutions for base stations. Now, envision the technology that makes all of this is possible. Texas Instruments Incorporated (TI) (NASDAQ: TXN) today is unveiling the industry’s most comprehensive wireless infrastructure System-on-Chip (SoC), featuring an ideal mix of processing elements for both ultra-high capacity small cell and macro base stations. TI’s scalable TMS320TCI6636 delivers breakthrough performance, simultaneous 3G and 4G coverage and capacity expansion features that wireless operators and their users will love. For more information please visit www.ti.com/multicore.
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Achieving another wireless connectivity milestone, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the WiLink™ 8.0 product family: a collection of 45-nanometer single-chip solutions that integrate up to five different radios, and set the stage for next-generation mobile Wi-Fi®, GNSS, NFC, Bluetooth® and FM transmit/receive applications. The WiLink 8.0 architecture supports various combinations of these technologies, allowing for customized solutions to address the unique needs and price points of all mobile markets. Each chip variant comes in a compact WSP package that can be mounted directly on a PCB, and includes all required RF front ends, a complete power management system, and comprehensive coexistence mechanisms. At the system level, the five-radio WiLink 8.0 chip offers a 60 percent cost reduction, 45 percent decrease in size and 30 percent lower power consumption compared to traditional multi-chip offerings. Complete details: www.ti.com/wilink8.
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Building from more than a decade of proven leadership in the wireless connectivity space, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today unveiled the SimpleLink™ product family, the industry’s widest portfolio of easy-to-use wireless connectivity technologies for low-power, low-cost embedded applications. The SimpleLink family includes self-contained wireless processors, aimed at enabling easy integration with any embedded system.
The cornerstone offering in this new family is the new SimpleLink Wi-Fi® CC3000 product: an easy-to-implement Wi-Fi solution that will lead the charge in expanding the world’s Internet of Things. The SimpleLink Wi-Fi CC3000 is a self-contained 802.11 network processor, making it ideal for simple and quick addition of Internet connectivity to any embedded application. For full details on the SimpleLink Wi-Fi CC3000 and all SimpleLink products, visit http://ti.com/simplelink.
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Imagine upgrading from ARM9™-based product designs to add 3D interactive touch screens, higher resolution displays, faster performance and multiple, flexible integrated connectivity options for a more robust offering — all while keeping design costs and power levels low. Visualize taking these new products to market in six months with an inexpensive development platform and free, complete software development kit. Texas Instruments Incorporated (NYSE: TXN) (TI) now makes this design vision a reality with its new Sitara™ AM335x ARM® Cortex™-A8 microprocessors .
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Designed to help developers obtain safety certifications, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced its new Hercules safety microcontroller platform for medical, industrial and transportation applications. The platform consists of three ARM Cortex-based microcontroller families that deliver scalable performance, connectivity, memory and safety features for applications that require a high level of reliability. Unlike many microcontrollers that rely heavily on software for safety capabilities, Hercules microcontrollers implement safeguards in hardware to maximize performance and reduce software overhead. Coupled with robust tools, software and safety documentation, this functionality gives developers the headroom to differentiate their end products and speed time to market. For more information, visit www.ti.com/hercules-pr-lp.
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Texas Instruments Incorporated (NYSE: TXN) (TI) today unveiled the TMS320TCI6612 and TMS320TCI6614, the industry’s most comprehensive System-on-Chips (SoCs) for developers of metro, pico and enterprise small cell base stations. TI’s new small cell SoCs are enabled with production ready software and are the highest performing devices available for small cells. Based on TI’s innovative KeyStone multicore architecture, these scalable SoCs encompass a mix of processing elements including radio accelerators, network and security coprocessors, combined fixed-and floating-point digital signal processors (DSPs) and an ARM® RISC processor, providing the ideal foundation for layers 1, 2 and 3 and transport processing for high performance small cell base stations.
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Texas Instruments Incorporated (TI) (NYSE: TXN) today announced delivery of a mobile-grade, battery-optimized Wi-Fi solution to the open source Linux community as part of the OpenLink™ project, focused on providing a wide range of wireless connectivity solutions for native Linux. Customers and developers targeting battery-powered Wi-Fi products can now use TI’s OpenLink drivers, gaining native kernel benefits such as tested technologies, faster time-to-market, and simplified re-integration when upgrading from one kernel version to the next. In addition to Wi-Fi, the OpenLink project includes native Linux solutions for Bluetooth® and FM technologies, and will expand to support other technologies such as ANT, Bluetooth Low Energy and ZigBee®. TI will also introduce additional low-power features to the kernel when possible. Visit www.openlink.org for source code, development projects, community support and more.
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Texas Instruments Incorporated (TI) (NYSE: TXN) announced today the next generation of its popular OMAP™ family: the OMAP 5 mobile applications platform, which is positioned to transform how mobile devices, such as Smartphones, tablets and other mobile form factors are used, making them even more valuable in our daily lives. More information on the OMAP 5 platform can be found here: www.ti.com/wbu_omap5_pr_lp.
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Texas Instruments Incorporated (TI) (NYSE: TXN) today introduced the CC2567 device, the first wireless, single-chip solution that enables direct short-range communication between ultra low-power, ANT™+-enabled devices and commonly used mobile devices relying on Bluetooth® technology such as PCs, Smartphones and tablets. The industry’s first dual-mode device, the CC2567 requires 80 percent less board area than a design with two single-mode solutions (one ANT+, one Bluetooth), enables simultaneous operation over a shared antenna with built-in coexistence, and increases the wireless transmission range up to two times the distance of a single-mode ANT+ solution.
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