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Envision a wireless experience with maximum data rates and no dropped calls at cell edges. Envision limited service areas being a thing of the past. Envision lower costs and greener solutions for base stations. Now, envision the technology that makes all of this is possible. Texas Instruments Incorporated (TI) (NASDAQ: TXN) today is unveiling the industry’s most comprehensive wireless infrastructure System-on-Chip (SoC), featuring an ideal mix of processing elements for both ultra-high capacity small cell and macro base stations. TI’s scalable TMS320TCI6636 delivers breakthrough performance, simultaneous 3G and 4G coverage and capacity expansion features that wireless operators and their users will love. For more information please visit www.ti.com/multicore. To view Multimedia News Release, go to http://www.multivu.com/mnr/54042-texas-instruments-ti-multi-standard-soc-ultra-high-capacity